錫鋅系五元無鉛銲錫球與BGA基板Cu/Ni-P/Au界面之研究

Interfacial Bonding Behavior between Sn-Zn Series Lead-Free Solders and Cu/Ni-P/Au Substrate

10.6409/JMSE.200503.0041

邱盈達(Y. T Chiu)；林光隆(K. L. Lin)

錫鋅系銲錫 ； 時效處理 ； BGA ； 介金屬化合物 ； Sn-Zn Series Lead-Free Solders ； aging treatment ； BGA ； intermetallics

材料科學與工程

37卷1期（2005 / 03 / 01）

41 - 45

繁體中文

本實驗是研究Sn8.5Zn0.5Ag0.01Al0.1Ga (wt%)五元無鉛銲錫球與Cu/Ni-P/Au的BGA基板之界面行爲，使用Sn-Zn專用助熔劑，重流溫度爲220℃，持溫時間爲60秒，再利用剪力强度試驗機測試五元錫球與Cu/Ni-P/Au的BGA基板間的剪力强度，並且經過5次重流和時效處理100小時，500小時，再觀察界面的顯微結構。實驗結果顯示，五元錫球與Cu/Ni-P/Au的BGA基板的界面形成之介金屬化合物分別爲AgZn3、AuZn3，五次重流後AgZn3層有晶粒成長現象。試片再經過時效處理100小時，則會出現一層較不明顯(Ag, Au)Zn3在AgZn3、AuZn3之間，時效處理500小時，這一層(Ag, Au)Zn3則有逐漸增厚的趨勢。

Au/Ni-P plated Cu pads were reflow soldered by using Sn8.5Zn0.5Ag0.01Al0.1Ga (wt%) solder balls. The shear strength and microstructure of the as-reflowed solder joints were investigated. The interfacial bonding behavior between Sn8.5Zn0.5Ag0.01Al0.1Ga (wt%) solder balls and Cu/Ni-P/Au substrates were studied. The solder joints were exposure to 5 times reflow, aging 100 hours and aging 500 hours. The peak temperature of reflow was 220℃ for 60 seconds and the temperature of aging treatment was 150℃. Baesd on the experimental result, there are two reaction layers of AuZn3, AuZn3 intermetallics between solder balls and Cu/Ni-P/Au substrates after as-reflow. The grain of AgZn3 grew after 5 times reflow. On the other hand a reaction layer of (Ag, Au) Zn3 apeared between AgZn3, AuZn3 after aging 100 hours. The reaction layer of (Ag, Au) Zn3 were getting thicker after aging 500 hours. The shear strength of the as-reflow solder ball is 1807.7g while it is 1706.6g after 5 times reflow.