Al添加物對高體積比Si粒子—銅基復合材料之腐蝕行為研究

Effects of al additive on the corrosion properties of silicon reinforced copper matrix composites

10.6376/JCCE.200206.0137

李源發(Yuang-Fa Lee)；李勝隆(Sheng-Long Lee)；梁國柱(Kou-Zoo Liang)

Cu/Si(下標 P)復合材料 ； 熱壓燒結 ； 電子構裝材料 ； 腐蝕電位 ； 腐蝕電流密度 ； Cu/Si(下標 P)composite ； hot pressing ； Al electronic packaging ； corrosion potential ； corrosion current density

防蝕工程

16卷2期（2002 / 06 / 01）

137 - 148

繁體中文

本研究係以熱壓法製造低熱膨脹、高熱傳導與低密度之50-80vol.%Si粒子－銅基電子構裝材料，探討添加5-10vol.%Al對Cu/Si(下标 p)複合材料之腐蝕行為及其影響。由實驗結果得知，添加5-10vol.%Al可增強Cu/Si(下标 p)複合材料之Cu-Si介面接合強度、降低Cu/Sip複合材料之孔隙率與脆性Cu2Si介金屬之生成。於5%NaCl/pH6.7溶液中之抗腐蝕性研究，添加5-10vol.%Al於Cu/Si(下标 p)複合材料中，其腐蝕電位、腐蝕電流密度與Cu-Si間之隙縫腐蝕皆隨Al含量之增加而降低。另外，腐蝕表面經由ESCA腐蝕表面成分分析，添加Al元素於Cu/Si(下标 p)複合材料中，Cu基地中含有CuAl2增強Cu-Si介面接合強度，而且腐蝕表面易生成Al2O3

Silicon reinforced copper matrix composites containing 50-80 vol.% Si and 0-10 vol.% Al were fabricated by hot pressing. The results show that the flexural strength and the corrosion resistance in 5% NaCl solutions are promoted when the Cu/Si (subscript p) composites were added with 5-10vol. % Al. In addition, the porosities of the Al-contained composites are lower than those of the composites without Al addition. By analyses of the corroded surface using ESCA spectrums and SEM photographs, Al2O3 films on the corroded surfaces can reduce the forming of Cu2O and SiO2, crevices and peeling of Si particles.