Variation Pattern Identification and Fault Diagnosis of Solder Paste Deposit by Using Independent Component Analysis

10.6220/joq.2012.19(1).02

Wei-Shing Chen

solder paste printing ； fault diagnosis ； variation pattern identification ； independent component analysis

品質學報

19卷1期（2012 / 02 / 01）

20 - 38

英文

The objective of this paper is to identify the variation pattern vectors based on a simulated sample of measurement data and then to use the estimates to gain insight into the root cause of the variation patterns in a solder paste printing process. Independent component analysis (ICA) is applied to identify variation pattern and diagnosis faults. From the results of the case study, it indicates that the direction and magnitude of coefficients in the mixing matrix can be restored in a meaningful approach by using the proposed approach. However, the proposed method in this paper for estimating patterns has several limitations, such as a high level of user subjectivity in the ambiguity reduction of mixing matrix.

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