Parametric Design of the Adhesive Dispensing Process with Multiple Quality Characteristics

點膠製程之多重品質參數設計

10.6220/joq.2014.21(4).02

黃乾怡(Chien-Yi Huang)；柏家洛(Carlo Palacios)；洪滋霞(Zih-Sia Hong)；陳清祥(Ching-Hsiang Chen)

參數設計 ； 表面黏著技術 ； 點膠製程 ； parametric design ； surface mount technology ； adhesive dispensing

品質學報

21卷4期（2014 / 08 / 30）

233 - 245

英文

為因應電子產品微小化市場需求，導致表面黏著技術取代傳統的引腳插入技術。製程中將點膠膠水塗佈於元件本體底部，經迴焊後固化。固化溫度曲線需同時考量錫球特性而形成良好焊點，以及膠水特性確保元件有效的黏著於印刷電路板 （Printed Circuit Board, PCB）上，不會於波峰焊製程或人工搬運過程發生元件掉落。本研究運用田口方法設計實驗，應用理想解類似度偏好順序評估法（The Technique for Order of Preference by Similarity to Ideal Solution, TOPSIS）及主成分分析（Principal Component Analysis, PCA）分別決定最適製程參數組合。經由建議製程生產測試樣本，再藉由推力測試評估其有效性。最後，進行確認實驗，結果顯示，信號雜音比皆落在信賴區間95%內，表示點膠接合的強度有明顯的改善。

In response to market demands, the miniaturization of electronic components has lead to the development of Surface Mount Technology (SMT) to replace the traditional Dual Inline process (DIP). Adhesive was deposited on the bottom side of the component body and cured during the reflow soldering. The curing (reflow) profile must simultaneously consider both the solder properties to form a desired solder joint and the adhesive properties to ensure that the component is effectively attached to the Printed Circuit Board (PCB) and does not fall off during the wave soldering process or manual handling of the board. This study uses Taguchi method for experimental design; the Technique for Order of Preference by Similarity to Ideal Solution (TOPSIS) and Principal Component Analysis (PCA) statistical methods to determine the process parameters. Test samples are manufactured by the suggested process and thrust tests are performed to verify its effectiveness. The results from the confirmation tests show that a significant improvement in the adhesive bonding strength is achieved using the suggested process scenario and that the S/N ratio falls into the estimated 95% confidence interval.

1. Bashiri, M.,Hejazi, T. H.(2012).A mathematical model based on principal component analysis for optimization of correlated multiresponse surfaces.Journal of Quality,19(3),223-239.
   連結：
2. Hotelling, H., 1933, Analysis of a complex of statistical variables into principal components, Journal of Educational Psychology, 24(7), 498-520
3. Arra, M.,Shanqquan, D.,Yi, S.,Thalhammer, R.,Fockenberger, H.(2002).Development of leadfree wave soldering process.IEEE Transactions on Electronics Packaging Manufacturing,25(4),289-299.
4. Bisgaard, S.,Huang, X.(2008).Visualizing principal components analysis for multivariate process data.Journal of Quality Technology,40(3),299-309.
5. Boden, P. J.(1994).Surface mount technology - a study of safety considerations: silver migration and adhesive flammability.IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging,17(1),83-90.
6. Brodsky, W.,Parker, F.,Shoenthaler, D.(1980).Development of a 68-pin multiple in-line package.IEEE Transactions on Components, Hybrids, and Manufacturing Technology,3(4),594-601.
7. Chan, K. Y.,Kwong, C. K.,Tsim, Y. C.(2010).Modeling and optimization of fluid dispensing for electronic packaging using neural fuzzy networks and genetic algorithms.Engineering Applications of Artificial Intelligence,23(1),18-26.
8. Colosimo, B. M.,Pacella, M.(2011).Analyzing the effect of process parameters on the shape of 3D profiles.Journal of Quality Technology,43(3),169-195.
9. Corchado, J. M.(ed.),De Paz, J. F.(ed.),Rocha, M. P.(ed.),Riverola, F. F.(ed.)(2009).2nd International Workshop on Practical Applications of Computational Biology and Bioinformatics (IWPACBB 2008),Berlin, Germany:
10. Gradiz, O.,Palacios, C.,Huang, C.-Y.(2013).The parametric design of adhesive dispensing process with multiple quality characteristics.Proceedings of the Institute of Industrial Engineers Asian Conference 2013
11. Hu, G.,Tan, J.(2010).Investment decision-making method of real estate project based on grey correlation and TOPSIS.Proceedings of 2010 International Conference on E-Business and E-Government (ICEE)
12. Huang, C.-Y.,Huang, H.-H.,Ying, K.-C.(2012).Sn-Cu-Ni soldering process optimization using multivariate analysis.IEEE Transactions on Components, Packaging and Manufacturing Technology,2(3),527-535.
13. Huang, C.-Y.,Ying, K.-C.,Tsai, X. L.(2006).The optimization of stencil printing process for lead free materials.Journal of Technology,21(3),227-236.
14. Kim, G.,Park, C. S.,Yoon, K. P.(1997).Identifying investment opportunities for advanced manufacturing systems with comparative-integrated performance measurement.International Journal of Production Economics,50(1),23-33.
15. Liu, S.,Mei, Y.(1995).Behavior of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption, and wave soldering.IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A,18(3),634-645.
16. Lu, X.,Meng, J.(2010).Notice of retraction interval appraise method based on grey relation and TOPSIS.Proceedings of 2010 International Conference on Intelligent Computing and Cognitive Informatics (ICICCI)
17. Su, C. D.(2002).Quality Project.Taipei, Taiwan:Chinese Society for Quality.
18. Sun, X.-D.,Jiao, Y.,Hu, J.-S.(2005).Research on decision-making method based on gray correlation degree and TOPSIS.Chinese Journal of Management Science,13(4),63-68.
19. Vincent, J. H.,Humpston, G.(1994).Lead-free solders for electronic assembly.GEC Journal of Research,11(2),76-89.
20. Wable, G.,Chu, Q.,Damodaran, P.,Srihari, K.(2006).Wave soldering using Sn/3.0Ag/0.5Cu solder and water soluble VOC-free flux.IEEE Transactions on Electronics Packaging Manufacturing,29(3),202-210.
21. Wang, J.,Wen, L.,Zhou, J.,Chung, M.(2011).Mechanical properties and joint reliability improvement of Sn-Bi alloy.Proceedings of 2011 IEEE 13th Electronics Packaging Technology Conference (EPTC),492-496.
22. Wang, Y.,He, Z.(2008).A TOPSIS based robust optimization methodology for multivariable quality characteristics.Proceedings of 2008 IEEE International Conference on Service Operations and Logistics, and Informatics
23. Yoon, K.(1980).Manhattan, KA.,Kansas State University.

1. Wu, Pei-Yu,Jhang, Jhy-Ping(2017).APPLICATION OF ARTIFICIAL NEURAL NETWORK AND TOPSIS FOR THE OPTIMAL THRUST OF SMT DISPENSING PROCESS PARAMETERS.品質學報,24(5),324-334.