题名

The Application of FMEA and QFD to the Improvement of Packaging Processes for Transistors

并列篇名

運用FMEA與QFD於電晶體封裝製程新產品之開發

DOI

10.6220/joq.2015.22(5).05

作者

李明賢(Caleb Ming-Hsien Li)；葉兆雄(Benjamin Chao-Hsiung Yeh)；雷方奕(Al-Refaie Abbas)；郭修瑋(Hsiu-Wei Kuo)

关键词

品質機能展開 ； 失效模式與效應分析 ； 顧客抱怨 ； QFD ； PFMEA ； customer complaints

期刊名称

品質學報

卷期/出版年月

22卷5期（2015 / 10 / 31）

页次

441 - 460

内容语文

英文
中文摘要

本研究的目的是整合品質機能展開（quality function deployment, QFD）及製程失效模式與效應分析（process failure mode and effects analysis, PFMEA）運用於電晶體封裝新產品的開發，顧客的聲音藉由品質機能展開轉換並融入製程，並將顧客抱怨項目與QFD相互比較，PFMEA應用於各個製程的各個加工站，接著PFMEA和QFD依顧客抱怨項目逐一修正。結果，重加工成本每年節省$559,000,000元。因此，整合PFMEA與QFD降低了工程變更的數目和顧客抱怨的數目，同時也提高良率。
英文摘要

This paper integrates Quality Function Deployment (QFD) and Process Failure Mode and Effect Analysis (PFMEA) to improve the performance packaging processes for Transistors. The voices of customers are transferred and merged into the processes by QFD. Customer complaints are collected and compared with QFD. PFMEA is then applied at each station in each process. Finally, PFMEA and QFD are revised in accordance with the customer complaints. As a result, the total saving in rework expenses is $559,000,000 NT dollars per year. In conclusion, the integration of PFMEA with QFD helps engineers decrease the number of engineering changes, reduce the number of customer complaints, and increase yield rate.
主题分类 社會科學 > 管理學
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被引用次数
  1. 葉子明、陳佳恩、白凢芸(2019)。應用PEM和FMEA探討高雄駁二藝術特區遊客滿意度。品質學報，26(2)，71-91。
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