NEW GENERATION PRODUCT PROCESS CAPABILITY SET UP

新世代產品的製程能力建立

10.6220/joq.201910_26(5).0004

劉鴻豪(Halley Liu)；吳育儒(Eric Wu)

printed circuit board (PCB) ； every layer interconnection (ELIC) ； high density interconnect (HDI) ； design of experiment (DOE) ； 印刷電路板 ； 逐層互連技術 ； 高密度互連技術 ； 實驗設計

品質學報

26卷5期（2019 / 10 / 30）

338 - 350

英文

Printed circuit board (PCB) industry has developed for a long time. New type and high level cell phones are mostly applied to high density interconnect (HDI) production, especially Every layer interconnection process (EILIC) is widely used. Due to the fact that traditional process has upgraded to higher level process, new material/parameter optimization/key process risk control and prevention are the main concerns of this project. In order to be beneficiary to fine line process in this project, copper is needed to be revised to 3 um and limited bond film. According to our previous technics and experience, new product introduction (NPI) could not be produced by original model; that is, it could not meet reliability requested by customers and sample scrap rate was 100%. For the purpose of accomplishing the new production requests of our customers, we follow the steps of Six Sigma methodology-DMADV (define, measure, analyze, design, verify) to implement this project. In this project, the critical processes were determined by the deployment matrix; the optimized level combination of the main factors was obtained through design of experiments (DOEs). After analyzing and improving, this project could achieve the goal of the new production. The yield was improved from 0% to 79.9% and the benefit estimation was NT$ 17 million per year.

印刷電路板製作發展由來已久，新款高階手機生產更為目前業界高密度互連技術（high density interconnect，HDI）主要產品，而於製作方法中以各層互連技術（every layer interconnection，ELIC）流程最廣為應用，故從既有流程轉變成新手機產品流程過程中，對於新材料導入、參數優化以及關鍵流程風險點管控預防，亦為本專案執行主軸方向。本專案中為由客戶新產品介紹（new product introduction，NPI）產品為利於細線路製作，銅厚需進行下修3um及限定特定作業流程（棕替化）做為展開，鑑於既往技術累積經驗此流程並無法於固有量產模式下執行出貨（無法符合客戶可靠度項目出貨水準及關鍵流程〔雷射〕無法突破，試樣報廢率達到100%）。為使專案達標及達成此項客戶新產品需求及，我們依循DMADV（define, measure, analyze, design, verify）步驟執行推動專案；此方法論使用多項工具進行問題的層別解析，例如：特性要因矩陣、變異數分析（analysis of variance，ANOVA）、假設檢定與實驗設計。藉由特性要因矩陣（cause & effect matrix）決定了關鍵雷射流程,並應用假設檢定方法驗證出流程中顯著影響因子，使用3因子2水準。實驗計畫（design of experiments，DOE）方法找出可突破現有風險點的最穩健配置參數。由於以上工具應用，使得此專案順利達成新產品導入（由專案前功能性良率0%提昇至79.9%），並續追蹤估算產出年效益約達1,700萬／元；另外對於6-Sigma方法論更深一層瞭解與實戰應用，並同步未來專案水平學習與展開。

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