應用DMAIC提升SMT錫膏印刷之品質

APPLICATION OF DMAIC TO IMPROVE THE QUALITY OF SMT SOLDER PASTE PRINTING

10.6220/joq.202002_27(1).0003

黃允成(Yun-Cheng Huang)；黃俊淵(Jun-Yuan Huang)；丁儀安(Yi-An Ding)；侯宜璇(Yi-Xuan Hou)

錫膏印刷 ； 多段式兩水準參數優化 ； 全因子實驗設計 ； 田口方法 ； paste printing ； multi-stage two-level parameter optimization ； full factorial experimental design ； Taguchi method

品質學報

27卷1期（2020 / 02 / 28）

43 - 68

繁體中文

基於消費者對電子產品可靠度之要求，如何管控與提高表面貼裝技術（surface mounting technology, SMT）之品質也成為電子產業之重要議題。本研究之目的即在證明參數設定之合理性與尋求製程參數之最佳化，進而有效控管產品之品質，以達到客戶需求及提升客戶滿意度。本研究將以六標準差之DMAIC（define, measure, analyze, improve, control）改善流程，搭配「多段式兩水準」全因子實驗來達成製程參數最佳化。經實例驗證結果顯示，錫膏印刷之製程能力確實明顯提升，更證明「多段式兩水準」之參數優化方法除較傳統全因子實驗更加精簡外，在因子間之交互作用顯著時，其改善效果亦優於田口方法。

Based on consumers' requirements for the reliability of electronic products, how to control and improve the quality of surface mounting technology (SMT) has also become an important issue in the electronics industry. The purpose of this study is to prove the rationality of parameter setting, seek the optimization of process parameters, effectively control the quality of products, meet customer needs, and improve customer satisfaction. In this study, the DMAIC (define, measure, analyze, improve, control) improvement process of six standard deviations will be combined with the ＂multi-stage two-level＂ full factorial experiment to optimize the process parameters. The experimental results show that the process capability of solder paste printing is obviously improved. The optimization method of ＂multi-level two-level＂ parameter is more streamlined than traditional full factor experiments. When the interaction between factors is significant, the improvement effect is better than Taguchi method.

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