| 题名 |
高頻軟板增層膠開發及應用 |
| 并列篇名 |
Development and Applications of Bonding Sheet for mmWave Communication |
| 作者 |
陳維彥(Wei-Yen Chen)；高瑞富(Jui-Fu Kao)；李聖德(Sheng-De Li)；徐偉智(Way-Chih Hsu)；蔡志勇(Chih-Yung Tsai)；黃麟強(Lin-Chiang Huang)；黃銘郁(Ming-Yu Huang)；林建琛(Jann-Chen Lin) |
| 关键词 |
低介電增層膠 ； 軟性印刷電路板 ； 聚苯醚 ； 樹脂 ； 雙環戊二烯 ； Low Dielectric Bonding Sheet ； Flexible Printed Circuit Board ； Polyphenylene Ether ； Resin ； Dicyclopentadiene |
| 期刊名称 |
石油季刊 |
| 卷期/出版年月 |
57卷4期（2021 / 12 / 01） |
| 页次 |
35 - 54 |
| 内容语文 |
繁體中文 |
| 中文摘要 |
近年來，隨著電子產品趨向輕薄短小、行動化與高傳輸速率，促使電子產業技術朝薄型化、高頻、高速及高密度構裝方向發展，透過電子構裝技術將半導體積體電路與其他電子元件共同組裝至印刷電路板，其中軟性印刷電路板（FPC）具有可撓彎、配合產品需求達到任意形狀、曲度的立體構型，更適於應用在物聯網及穿戴裝置。隨著行動通訊高度開發，軟板高頻高速化、功能化發展亦刻不容緩，為開發低介電與低傳輸損失之軟板材料，本團隊將具有高耐熱、低極性、低吸濕及低介電等特性的雙環戊二烯（Dicyclopentadiene, DCPD）導入，作為聚苯醚材料核心，開發具有低介電常數（Dielectricconstant, D_k）與散逸係數（Dissipation factor, D_f）的DCPD衍生物樹脂，可應用於5G高頻基板領域，並建立軟性基板增層膠配方設計、材料特性驗證以及製程調控等技術。透過調控參數所自製出之軟板增層膠，經測試相關性質顯示其具有優越性質，其玻璃轉化溫度（T_g）比商業產品配方高出28-59℃；而電氣性質D_k/D_f @ 10 GHz最佳為2.40 / 0.00351。隨著5G世代的爆炸性發展，高頻高速樹脂原料供不應求，以致價格居高不下，若能即時投入市場填補每年數百噸以上的空缺，將能有莫大利基。本公司DCPD聚苯醚合成及製程技術已取得中華民國專利，該樹脂之高頻軟板增層膠配方專利申請中，除此之外，目前正進行噸級試量產且產品經銅箔基板廠測試性能已驗證合格，未來將量產投入高頻基板樹脂產品市場，成為另一擁有相關技術之供應廠商。 |
| 英文摘要 |
In recent years, as electronic products tend to be lighter, thinner, shorter, mobile, and high transmission rate, the electronic industry technology has been promoted to develop in the direction of thinner, high-frequency, high-speed and high-density packaging. Semiconductor integrated circuits and other electronic components are assembled together on the printed circuit board through electronic packaging technology. The flexible printed circuit (FPC) board has a three-dimensional configuration that can be bent and can meet the requirements of the product to achieve any shape and curvature, and is more suitable for applications in the Internet of Things and wearable devices. With the high development of mobile communications, there is an urgent need for the development of high-frequency, high-speed, and functional FPC. In order to develop low dielectric constant and low transmission loss FPC materials, dicyclopentadiene (DCPD) with high heat resistance, low polarity, low moisture absorption, and low dielectric properties is introduced to be the core of polyphenylene ether materials. DCPD derivative resins with low Dk/Df are developed, which can be applied to the field of 5G high-frequency substrates, and build FPC bonding sheet glue formula, material characteristic verification and manufacturing process control. The self-made FPC bonding sheet made by adjusting the parameters has been tested and the relevant properties show that it has superior properties. Its glass transition temperature (Tg) is 28-59℃ higher than the commercial product formulation and the best electrical properties Dk/Df @ 10 GHz is 2.40/0.00351. With the explosive development of 5G, high-frequency and high-speed resin raw materials are in short supply, resulting in high prices. If it can be put into the market immediately to fill the vacancies of hundreds of tons per year, there will be a great niche. The company's DCPD polyphenylene ether synthesis and process technology has obtained a patent from the Republic of China. The resin's high-frequency FPC bonding sheet formula patent application is in progress. At present, it is undergoing trial mass production of 1000 kilograms and the performance of the product has been verified by copper clad laminate factories and passed. In the future, the mass production of DCPD polyphenylene ether resin will be put into the market of low loss resin for mmWave communication and become another supplier with related technologies. |
| 主题分类 |
工程學 >
礦冶與冶金工程 社會科學 > 經濟學 |
| 参考文献 |
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