無電電鍍銅在不同還原劑及沉積因素中之研究

The Effects of Reductants and Deposition Variables on the Electroless Deposition of Copper

林雋淼(Jyun-Miao Lin)；楊希文(His-Wen Yang)；朱錦明(Chin-Ming Chu)

無電電鍍 ； 硫酸銅 ； 次磷酸鈉 ； 甲醛 ； electroless ； Copper(II) sulfate ； sodium hypophosphite ； formaldehyde

聯大學報

13卷1期（2016 / 12 / 01）

99 - 108

繁體中文

無電電鍍是將無法導電的物質如：塑膠、陶瓷、玻璃等表面進行金屬化處理，甚至矽晶圓要鍍銅前，先無電電鍍鈦或鎳薄層。使其表面有一層導電的金屬膜，再藉由電化學氧化還原反應，使表面包覆一層金屬膜，可以增加美觀，又能防蝕，並可防止矽原子與金、銅原子互相擴散成矽化金與矽化銅合金。本研究是針對不同還原劑、濃度、酸鹼度(pH 值)，進行無電電鍍銅，目的是為了進一步了解在固定時間下可得到較好的鍍膜且產率較多。由本研究可得知，在低pH 值溶液有利於以次磷酸鈉為還原劑進行反應；在高pH 值溶液有利於以甲醛為還原劑進行反應。

Electroless plating is deposition of metals/alloys on the surface of materials which are not electric conductors such as plastics, ceramics, and glass. Electroless plating makes attractive appearance and prevent corrosion of materials. Sputtering of titanium or electrleoss plating of nickel before electroplating of gold or copper is commonly found on the processes of silicon wafer manufactures. These films can inhibit silicon atoms to diffuse into gold or copper atoms for the formation of silicon alloys. This study conducts a research aiming at the effects of types of reductants, concentration of reductants, pH value on the samples pretreated with roughening, sensitizing, activating. From the results in this study, the solutions with low and high pH values are preferred for the electroless deposition of copper using sodium hypophosphite and formaldehyde, respectively.

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