高亮度微型投影機光源之熱傳效益改善研究

Improvement of Heat Transfer Performance for Light Source of High Brightness Pico Projector

張智揚(Chih-Yang Chang)；李金連(King-Lien Lee)

微投影機 ； 導熱 ； 發光二極體 ； 印刷電路板 ； pico projector ； heat conductivity ； FloTHERlVI® ； LED ； Printed circuit board

臺北科技大學學報

46卷1期（2014 / 06 / 01）

39 - 45

繁體中文

本研究使用有限體積分析軟體FloTHERM®對微投影機的高功率發光二極體（LED）、印刷電路板（PCB）與散熱月之散熱血統作模擬熱場分析。基於散熱網的概念，改善丘簡化LED導熱途徑，接著針對PCB上方銅箔的分布與厚度作探討；經模擬數據結果顯示，多個LED可藉由調整銅箔的分布，來避免每顆LED因結面溫度不同而造成色偏影響光源品質。最後從PCB銅箔厚度與LED結面溫度的實驗數據中，得知在PCB上銅箔須有足夠的厚度，導熱效果才會顯著，最後改良結果使LED接面溫度下降約8℃～10℃，另外可改變PCB銅箔材質為銀箔，達到更好的導熱效果。

A finite volume method package (FloTHERM®) is used to analyze the temperature field of the Pico projector's high power LEDs, Printed circuit board (PCB) and heatsink. The thermal module method concept to improve and simplify the LED thermal transmission, and then explore the distribution and thickness for the the PCB top of the copper. The results of the the multiple LEDs by adjusting the distribution of the copper, to avoid color shift affect the light quality. The experimental data of the PCB copper thickness and LED junction temperature, we found that the copper must be enough thickness, and the heat conduction would be better. This result is the LED junction temperature down to about 8℃ to 10℃. The copper material can also replaced by silver, the LEDs thermal conductivity results will be better.