累積法分析晶片清洗最適化條件之研究

Optimal Conditions for Chips Cleaning Process by Using Taguchi Accumulation Analysis

10.7047/JLM.200712.0027

葉忠(Chung Yeh)；王仁助(Ren-Jhu Wang)

田口累積法 ； 直交表 ； 晶片清洗製程 ； 微塵物 ； Taguchi Accumulation analysis ； Orthogonal Arrays ； Chips Cleaning Process ； Particle

運籌與管理學刊

6卷2期（2007 / 12 / 01）

27 - 43

繁體中文

消費性電子產品隨著微電子科技的進步與市場的發展，企業間的競爭就不曾間斷過。消費者追求高品質與低價位的產品，正如同企業不斷將產品推陳出新與降低製造成本如出一輒。 本文針對感光晶片在封裝過程中應用田口累積法，研究清洗製程中去除微塵物的4個可控因子，以L9(3^4)直交表排定實驗組合進行部份因子實驗，並經過計算與分析後求得預測的最適化生產條件。最後；再經由驗證實驗證實預測的最適化生產條件確實可提升感光晶片的封裝良率。

There are more and more electric consumer products be used now, and there are more and more competitions among enterprises. People want to buy the products of higher quality with lower price; it's the same as manufacturers who want to improve the process create lower cost and keep the price competitive. In this paper, we studied the optimal conditions for Chips Cleaning Process by Using Taguchi Accumulation Analysis in the CMOS (Complementary Metal-oxide Semiconductor) image sensor assembly process and reduced the particles remain on the chip surface after Cleaning Process. We found out the major effect factors in the cleaning machines by the experiments with L9(3^4) Orthogonal Array and Taguchi Accumulation analysis. Finally, we got high quality effect cleaning conditions and then the cleaning factors were verified by experiments. The experiments identified that the cleaning factors can provide better IC assembly yield.

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