聚乙烯醇對化學銅析鍍的影響及其應用在電磁波干擾遮蔽

Effects of Poly (vinyl alcohol) on Electroless Copper and Its Application to Electromagnetic Interference Shielding

10.29688/MHJ.201208.0002

張良濤(Liang-Tau Chang)；梁世明(Syh-Ming Lian)；顏志超(Chih-Chao Yen)

化學鍍銅 ； 添加劑 ； 聚乙烯醇 ； 銅鍍層結晶結構 ； 添加劑銅鍍表面型態 ； 電磁波遮蔽效果 ； electroless copper plating ； additives ； polyvinyl alcohol ； surface morphology ； electromagnetic interference(EMI) shielding

明新學報

38卷2期（2012 / 08 / 01）

13 - 23

繁體中文

本研究探討共同添加碘化鉀和聚乙烯醇對化學鍍銅鍍層之析鍍速率、表面形態、組成份、電阻之影響。結果發現添加穩定劑碘化鉀及聚乙烯醇會使析鍍速率變慢、但使鍍層的表面平整、結構緻密等。本研究另一個重點在於將析鍍後的銅箔試片運用於電磁波遮蔽方面，發現將聚乙烯醇與碘化鉀一同加入析鍍液中，會使得電磁波的遮蔽效果可達到78.7dB。

The main purpose of this research is to investigate the effect of potassium iodide (KI) and polyvinyl alcohol (PVA) on the plating rate, surface morphology, composition and resistivity of copper deposition. The results of adding potassium iodide and polyvinyl alcohol as additives to the borate buffered electroless copper plating solutions are that the plating rate was decreased, the surface morphology of copper deposition was smoothed and the structure of plating solution became denser. Another purpose of this study that is applying the electroless copper plating to the aspect of electromagnetic interference (EMI) shielding. It's found that by adding two additives PVA and KI together to the plating bath, EMI shielding effect (SE) is increased from 50dB to the best SE of 78.7dB.

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