銀銅殼核結構粉體製作及其抑菌活性之研究

Preparation and Antibacterial Property of Cu-Ag Core-Shell Particles

彭御賢(Yu-Hsien Peng)；楊志豪(Chih-Hao Yang)；陳冠廷(Kung-Ting Chen)；李清華(Ching-Hwa Lee)；許玉錡(Yu-Chi Hsu)；湯柏炘(Bo-Sin Tang)

銀銅殼核粉末 ； 無電電鍍 ； 抑菌活性 ； Cu-Ag core-shell particles ； electroless plating ； antibacterial property

科學與工程技術期刊

9卷1期（2013 / 03 / 01）

43 - 51

繁體中文

本研究主要探討以檸檬酸鈉作為分散劑與螯合劑於液相中以無電電鍍之方式合成銀銅殼核粉末，並針對不同[Ag^+]/[Cu]莫耳比合成之銀銅殼核粉體對於大腸桿菌與金黃色球菌之抑菌活性進行探討，其中當[Ag^+]/[Cu]莫耳比為0.07時所合成之粉體，其對大腸桿菌之抑菌環達到1.35mm，另對金黃色球菌之抑菌環可達3.15 mm之大小，相較於同等大小之銀粉或銅粉為佳。

Cu-Ag core-shell particles with silver layers were synthesized by electroless plating of Cu particles, silver sulfate, sodium citrate and ammonium hydroxide in an aqueous system. The influences of [Ag+]/[Cu] molar ratios on Cu-Ag core-shell particles with the best antibacterial properties at the molar ratio of [Ag+]/[Cu]=0.07. The inhabition zone of E. coli and S. aureus were, respectively, 1.35 mm and 3.15 mm which is better than copper and silver powders.