Optomechanical Design of Collimated UV Source Module

10.6567/IFToMM.14TH.WC.PS20.005

C.-H. Lee；C. C. Cheng；C. H. Liao

lithography ； UV ； PCB ； uniformity ； collimation

Proceedings of the 14th IFToMM World Congress

14th-5（2015 / 11 / 06）

573 - 576

英文

This paper presents a UV (ultraviolet) lithography apparatus that utilizes an array composed of UV-LED (light emitting diode) collimation modules as a micro-patterning light source for PCB (printed circuit board) fabrication. To provide a uniform (non-uniformity ＞ 90%) and collimated (FWHM ＜ ±2°) exposure area, hexagonal light source modules are disposed in a hexagonal array. Each module is consisted of a LED chip, a biconvex lens to enhance UV collimation and uniformity, and a hexagonal sidewall to absorb the side propagation UV light. The whole exposure system is thus composed a layer of heat sink (made of a copper cooling plate), a plurality of UV-LEDs disposed in an array, a baffle wall extending between UV-LED and the respective plurality of collimating lenses.