脈波電流鍍銅之電流效率受陰離子影響的研究

The Current Efficiency of Pulse Copper Plating

10.6623/chem.1992012

曾錦興(Giing-Shing Tzeng)

化學

50卷2期（1992 / 06 / 01）

125 - 132

繁體中文

本研究探討含不同陰離子之鍍液對脈波電流鍍銅之電流效率的影響。以脈波電流密度、通電時間和斷電時間作為實驗的變數，實驗結果發現氟硼酸銅和過氯酸銅鍍液之電流效率較硫酸銅鍍液者為低，可能是因氟硼酸或氯酸對剛還原的吸附銅原子具有效高之剝蝕作用所致。

This investigation is concerned wth the effect of anion on the current efficiency of copper deposition under conditions of pulsed current. The parameters include the pulsating current density, pulsedon time and pulsed-off time. The acidic copper fluoroborate or copper perchlorate electrolyte is found to have lower current efficiency than the acidic copper sulfate electrolyte. It is probable that fluoroboric acid or perchloric acid can exist higher degradationof adatom during the copper deposition than sulfuric acid, which results in a lower current efficiency.