Bond‐slip Finite Element Analysis Between Smooth Round Steel Bar and ECP Material

10.6911/WSRJ.202206_8(6).0091

Pengfei Zou；Jie Liu；Yangxiao Luo；Bin Yi；Beiping Tian

Bond force ； Bond‐slip ； Finite element simulation

World Scientific Research Journal

8卷6期（2022 / 06 / 01）

702 - 712

英文

This paper is based on a new type of energy‐saving wall material: the research of new energy‐saving wall material vacuum extrusion molding fiber cement board (ie ECP). In order to improve the stability of ECP and restrain the deformation of ECP, a steel‐ECP structure is proposed, and the bond‐slip relationship between members of different sizes is discussed. Abaqus finite element software is used to establish a separate model for steel bars and ECP materials, and interface elements are established to generate contact pairs to simulate the bond‐slip relationship between steel bars and ECPs. It can be seen that the larger the diameter of the round steel bar, the smaller the relative bonding area, so the bonding stress between the round steel bar with a larger diameter and the ECP material is smaller. The theoretical analysis of the finite element simulation data results shows that the finite element simulation analysis is reasonable.