题名 |
開放式冷櫃背板開孔優化探討 |
并列篇名 |
The Investigation of Perforated Back Panel Optimization in an Open-Type Refrigerated Display Cabinet |
DOI |
10.29911/JEHVACE_NEW.202209_(135).0003 |
作者 |
鄭博升;蔡明倫;胡立緯;謝佳興 |
关键词 |
冷凍冷藏展示櫃 ; 背板開孔 ; 計算流體力學 ; refrigerated display cabinet ; perforated back panel ; computational fluid dynamics |
期刊名称 |
冷凍空調&能源科技 |
卷期/出版年月 |
135期(2022 / 09 / 10) |
页次 |
37 - 46 |
内容语文 |
繁體中文 |
中文摘要 |
為解決既有開放式冷櫃之均溫性問題,本研究使用CFD模擬方式針對現有背板開孔樣式作優化,並以多孔隙材料比擬背板開孔狀況。優化後雖對於其冷凍能力並無影響,但卻可將TEF(thermal entrainment factor, TEF)從0.1507降至0.1375。透過補足第二、三層之背板出口氣流,以向櫃外抵抗外氣,最多可降低此處試驗包溫度達1.11℃;加密第六、七層之背板開孔雖可提升此處27%之流量,但對於試驗包溫度之降溫並無顯著效果,僅0.24℃之改善,主要因此處易受下方回風處熱傳導影響。 |
英文摘要 |
To optimize the temperature nonuniformity issue in the open type refrigerated display cabinet, the pattern or position of pore on perforated back panel was investigated through the CFD simulation in this study. With the optimization of back panel, the TEF was diminished from 0.1507 to 0.1375 whereas the required cooling load was almost the same. By supplementing the air flow from back panel in the 2^(nd) and 3^(rd) layer, the temperature of M-packages were reduced up to 1.11 ℃. The air flow from 6^(th) and 7^(th) back panel were volumetrically enhanced 27% with the increasing porosity, which had a minor effect on the temperature of M-packages unexpectedly. The temperature of M-packages in the 7^(th) layer was dominated by the heat conduction load from the lower return air duct that is still to be resolved. |
主题分类 |
工程學 >
電機工程 |
参考文献 |
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