题名

微加速度感測器受振動負載之有限單元應力分析

并列篇名

Vibration Analysis of Micro Accelerometer Using Finite Element Method

作者

陳書展

关键词

微加速度感測器 ； 應力分析 ； 有限單元分析 ； 振動分析 ； Micro-Accelerometer ； Stress analysis ； Finite Element Analysis ； Vibration Analysis

期刊名称

清華大學動力機械工程學系學位論文

卷期/出版年月

2016年

学位类别

碩士
导师

葉孟考
内容语文

繁體中文
中文摘要

科技日新月異的發展，不僅對我們的生活產生重大的改變，也為工業界帶來巨大的變革，因消費者對商品的需求，促使電子產品朝向複合功能且微型化的方向演進，以電子計算機為例，由早期處理速度為數毫秒的超大型電腦進展為現代以奈秒為計算單位的手持式平板電腦。但在如此有限的空間中塞入眾多的電子元件，造成彼此相互影響的機率提高，因此可靠性評估便成了相當重要的問題。本文以微加速度感測器(Micro Accelerometer)與FR-4印刷電路板(Print Circuit Board)結合的組件為研究對象，使用有限單元法進行應力分析。加速度計主要的功能是量測加速度，依據MIL-STD-883H制定的加速度測試實驗，對組件進行受慣性力的靜力分析，發現微加速度感測器受加速度影響，質量塊會產生較大的慣性力，使得彈簧結構有應力集中的現象；且因其特殊的八層結構導致彎曲變形成較複雜的形狀，因此彈簧結構成為較容易發生破壞的部分。另為避免運作時可能發生共振破壞，本研究對微加速度感測器進行模態分析，以獲得的模態資訊為之後的動態響應分析作參考；依據JEDEC規範的振動試驗條件，作振動響應分析，判斷組件遇振動負載時可能發生的失效現象，並改變阻尼參數探討對響應值的影響，本文研究的結果可提供微感測器研發者作為相關設計的參考。
英文摘要

The rapid development of science and technology not only changes our life but also brings a huge transformation for the industry. Demand for commodities urges electronic products toward multi-function and miniaturization. For example, in the early days computers had a large size and lower computational efficiency; and we can easily use a tablet in one hand recently. To avoid failure caused by populated electronic elements located in a small space, it has become an important issue to assess the reliability of these miniaturized electronic products. In this study, the stress and modal analyses of a micro-accelerometer, mounted on a FR-4 printed circuit board, were investigated using the finite element method. The micro-accelerometer assembly was simulated according to the level A, B and C of MIL-STD-883H standard and maximum stresses were obtained for the device under an inertia force. The results show that the spring of eight layers, connecting to the proof mass in the device, had a stress concentration at its corners, which became a potential failure location of the micro-accelerometer. The modal analysis for the micro-accelerometer under harmonic loading was also performed to understand the dynamic behavior of the micro sensor. The micro sensor was simulated according to JEDEC standard of vibration test, and it could determine whether the micro sensor failed or not. Various levels of damping were added in the analysis to investigate their effects on the dynamic response of micro sensor. These results could be provided as a design reference for the developer
主题分类 工學院 > 動力機械工程學系
工程學 > 機械工程
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