CMOS-MEMS 陀螺儀的設計與實現

Design and Implementation of CMOS-MEMS Vibrating gyroscopes

何承豫

CMOS-MEMS ； 慣性感測器 ； 共振式陀螺儀 ； CMOS-MEMS ； Inertia Sensor ； Vibratory gyroscope

清華大學動力機械工程學系學位論文

2016年

碩士

方維倫

繁體中文

本研究使用TSMC 0.18μm 1P6M 電路標準製程平台實現一微機電陀螺儀。而使用CMOS平台所製作的微機電陀螺儀，將會面臨在結構懸浮後，殘餘應力翹曲的問題，因此本研究期望透過整合現有文獻中，在結構設計上削減殘餘應力影響的辦法，包含對稱薄膜堆疊與純二氧化矽堆疊等，以期在不改變標準的電路製程參數下，實現一低應力翹曲結構的微機電陀螺儀，並同時仍保有CMOS平台的各式優點，如良好的繞線與線寬定義能力、可與電路及其他類型感測器整合達到單石化(Monolithic)等優勢。至於陀螺儀本身低結構敏感度的缺點，則透過CMOS製程平台小線寬的特性進行補償。

This study implements a MEMS gyroscope by TSMC 0.18μm 1P6M standard CMOS process. The structure which fabricates by this process must encounter the problem of residual stress warping. In order to reduce the deformation of the residual stress, this study integrates several structure design method in existing literatures. The design methods which be implemented in this research including symmetric stack structure and pure oxide structure are expected to achieve a structure of low residual stress warping. By this way, the fabrication parameter of this standard platform would not be modified to fit the demand of structure and the advantage of this platform would also be kept include monolithic integration capability and the good ability of electrical routing. However, for the gyroscope, the problem of low signal response may have chance to be compensated by the advantage of this platform which could make sub-micron sensing gaps.

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