撓性可拉伸式多功晶片網路之設計與實現

Design and Implementation of Flexible and Stretchable Multifunctional Chip Network

宋緯倫

大面積電子元件 ； 可拉伸彈簧 ； 微機電製程 ； 可回復性 ； 可撓性 ； Large area electronics ； Stretchable spring ； MEMS micromachining ； Recoverable ； Flexible

清華大學動力機械工程學系學位論文

2016年

博士

方維倫

繁體中文

本研究使用可拉伸彈簧實現具功能性節點與多元件整合的大面積可撓性電子元件。陣列內部的節點以彈簧互相連接，透過彈簧可拉伸的特性，使節點所佔的面積具擴展與調變的能力。彈簧作為機械或電性上的連接，而各種功能性元件可整合於節點上，達到各種不同應用需求。本研究以可拉伸彈簧作為主軸，提出四種不同的設計、特性、製程與功能性元件整合的大面積可撓性晶片網路陣列，並適用於不同應用範圍: (1)整合可拉伸金屬彈簧之大面積晶片網路: 其特色為金屬具機械連結與導電能力，並使用硬質基板整合功能性元件，其製程相容於傳統半導體製程；(2)鑲埋可拉伸導線之PDMS-fiber: 以高分子作為機械連接，鑲埋可拉伸導線作為電性連接，具備可編織的能力；(3)整合CNTs-Polymer彈簧之網路陣列: 藉由奈米碳管於不同位置可產生不同的功能性，且彈簧兼具可拉伸與可回復性；(4)具可拉伸單晶矽彈簧之網路陣列: 使用單晶矽製作具可拉伸與回復特性的彈簧，其製程相容於傳統半導體製程。本研究透過上述四種獨特之可拉伸元件設計並加以實現，使其具有大面積、可拉伸、可撓性與多功能整合之特性，未來可應用於各種大面積電子元件與穿戴式裝置上。

This study designed and implemented the multi-device integration of a flexible large area chip network using stretchable springs. The functional devices are directly implemented and integrated on the nodes of a chip network distribution, and the nodes are mechanically and electrically connected to surrounding nodes by stretchable springs. The springs can stretch and expand the distance between functional devices by several orders of magnitude to construct a large area chip network with interconnected devices. This study using the stretchable springs as a main purpose, and construct four different designs, features, manufacturing process and functional devices integrated for various applications. (1) Large area chip network using stretchable electroplated copper springs. (2) Devices integration with stretchable wire embedded in long PDMS-fiber. (3) Polymer springs with embedded CNTs electrical routing for large area electronics. (4) Large area devices using silicon stretchable springs. The study was implemented the four unique stretchable devices with large area, stretchable, flexible and multi-functional integrated. The future can be applied to a variety of large area electronics and wearable devices.

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