影響連接器塑膠本體貼合面平坦度之製程參數研究

The Influence of Processing Parameters on the Flatness for a Contact Surface of Plastic Connectors

10.29948/JAE.200804.0005

戴兢志(Ching-Chih Tai)；紀永良(Yung-Liang Chi)

模流分析 ； 誘導式類神經網路 ； 模擬退火演算法 ； 連接器 ； 平坦度 ； mold flow analysis ； abductory induction mechanism networks ； simulated annealing algorithm ； connector ； flatness

先進工程學刊

3卷2期（2008 / 04 / 01）

129 - 135

繁體中文

本研究主要目的是運用C-MOLD模流分析軟體，探討影響連接器塑膠本體貼合面平坦度的製程參數，製程參數分成模具設計參數與成形參數，其中模具設計參數包括塑膠材料、進澆方式和進澆口大小；而成形參數則考慮模具溫度、射出壓力、充填時間、保壓壓力、冷卻時間和熔膠溫度。 本研究採用兩階段分析，首先利用全因子實驗法探討模具設計參數對塑膠本體貼合面平坦度的影響，可獲得較佳平坦度的模具設計參數為基礎，第二階段整合田口式實驗設計與誘導式類神經網路，建立平坦度與成形參數間的關係模式，此關係模式經實驗驗證具有相當的可信度，最後利用模擬退火演算法進行成形參數最佳化。經由實驗驗證可知，本研究所提出的兩階段分析方法，其結果可以有效提升貼合面平坦度86.5%。

In this research, the main purpose is to apply C-MOLD software to discuss the process parameters affecting the flatness of the contact surface that the connector plastic housing with. The process parameters can be divided into mold design parameters and molding parameters. Mold design parameters include plastic materials, gate method and gate diameter. Moreover, mold temperature, injection pressure, filling time, packing pressure, cooling time and melt temperature are chosen as the considerations for molding parameters. The application in this research includes two stages to analyze. First of all, through full-factorial experiments to discuss the effect of mold design parameters to the flatness of the contact surface which the plastic housing with can get the mold design parameters with better flatness as the foundation. The second stage combines Taguchi method and abductive induction mechanism networks to build the connection between the flatness and molding parameters. With the verification of the experiment, this connection is certainly authentic. Lastly, simulated annealing algorithm is used to precede the optimal molding parameters. The experiment certifies that the result of two-stage analysis in the research can improve the flatness of contact surface 86.5% effectively.