樹脂凹版應用於塑材之移印適性研究

A Study of Photopolymers Intaglio Plate Printability of Pad Printing in Plastic

10.30153/JCAGST.200903.0006

陳忠輝(Chong-Hwi Chen)；黎定南(Ding-Nan Li)

移印 ； 樹脂凹版 ； 版紋深度 ； 附著度 ； Pad Printing ； Photopolymers Intaglio Plate ； the depth of image grave on plate ； adhesion

中華印刷科技年報

2009（2009 / 03 / 01）

65 - 85

繁體中文

因應世界環保潮流，移印正在不斷提升其環保品質，不但產品朝向少量多樣化之高附加價值，且製程中逐漸將傳統凹版，由原本使用的金屬版材改以樹脂取代。樹脂凹版兼具製版快速、耐磨性高、低污染等優勢，相當符合此產品的未來發展趨勢。為探討樹脂凹版對被印物的影響，本文主要針對其版紋深度與被印物的表面達因數，於製程中，樹脂凹版的版紋深度愈深，其填墨量愈多，經移印轉移至被印物上的墨層愈厚，與被印塑材（聚丙烯）表面達因數的變化，使附著度具有顯著的差異。研究結果發現：一、表面達因數越高則附著度越高，附著度與表面達因數有正因果現象存在。二、版紋深度越深則附著度越低，附著度與版紋深度有負因果現象存在。三、版紋深度與表面達因數對產品附著度有交互作用存在。四、產品附著度的最適化為控制版紋深度在20μm與30μm之間，而被印物的表面達因數達38dynes/立方公分，關聯方程式為附著度＝17.449＊表面達因數-7.394＊版紋深度＋36.616。以上乃提供移印適性改善之參考。

In accordance with the global trend of environmental protection, the traditional metal plate can be replaced by the Photopolymers one during the pad printing processes. The advantages of Photopolymers plate are rapid in plate-making, well in abrasion resistance and low in environmental contamination. The general direction of the pad print industry development is moving to a particular type of printing which is very friendly to environment and really suitable to handle the varied demands with small quantity in products. Therefore, it is perfectly applicable to produce the specific products with highly additional values. The aim of this study was to examine the printability of Photopolymers plate applied to polyacrylonitrile material in padprint. There were two factors controlled-one was the depth of image grave on plate and the other was the value of dyne of substrate surface-in order to find out how the adhesion of the printed images was affected. This study adopted the factorial experiment design with two factors: the depth of image grave on plate and the value of dyne of substrate surface. And each factor contained five levels. The deeper image grave the plate had, the more the ink would be held; consequently, the thicker the ink film was transferred from plate to the substrate. Finally, the thickness of ink film and the surface energy of substrate covered by ink were found that they had observable interaction to the performance of ink adhesion. The results of this investigation were below: 1. The adhesion goes up with the increased dyne value correspondingly. There is a positive correlation between the ink adhesion and the surface energy of substrate. 2. The adhesion descends according to the ascended depth of image grave. There is a negative correlation between the ink adhesion and the depth of image grave. 3. The depth of image grave and the surface energy of substrate interacted with the performance of ink adhesion respectively. 4. The optimal formula of ink adhesion is as the follow: Ink adhesion=17.449*dyne value-7.394*grave depth+36.616 And the recommended settings of grave depth and surface energy of substrate are below. ** Grave depth of images on plate: 20μm~30μm ** Surface energy of substrate: 38dynes/ cm^2

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