低介電常數與低消散因子聚苯醚接著劑之製備與鑑定

張晉榮

doi:10.6342/NTU201702189

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低介电常数与低消散因子聚苯醚接着剂之制备与监定

Synthesis and Characterization of PPE Based Adhesive Materials with Low Dielectric Constant and Dissipation Factor

张晋荣 , 硕士　　导师：陈文章　　

英文 DOI： 10.6342/NTU201702189

高频应用；可挠性；低介电常数；低消散因子；接着剂；聚苯醚高分子；氧化聚合； high frequency ； flexible ； low dielectric constant ； low dissipation factor ； adhesive materials ； poly (phenylene ether) ； oxidative polymerization

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摘要 │ 参考文献 (33) │ 国际计量

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Large capacity and a high transmission speed are required in wireless communication devices in recent years. The frequency of electrical signals has reached the GHz bands for next generation communication systems. For such high frequency applications, materials with low dielectric constants (Dk) and dissipation factors (Df) are indispensable. Moreover, as a basic electronic device, flexible printed circuit (FPC) possesses better lightness, flexibility, high wiring density, and space utilization than rigid printed circuit board (PCB). As the demand for miniaturization of electronic devices increases, the FPC has a great potential to be developed. Poly (phenylene ether) (PPE) is one of the most widely used industrial materials due to its good mechanical and thermal properties. It also shows excellent electric properties for use in high frequency applications. However, PPE exhibits a poor adhesion to the copper foil and their thermal and mechanical properties need to be improved for industrial applications. 
    In the first part of this thesis, we modify the commercial oligo (phenylene ether)-styrene end-functionalized materials OPE-2st with hydroxyl or carboxyl groups to improve the adhesion. On the other hand, the commercial biphenyl aralkyl resin (GPH) with allyl groups is used to improve the crosslink reaction. By blending these materials with rubber, epoxy, hardener, flame retardant, and filler, an adhesive film is prepared. After hot pressing it with copper foil, a flexible laminate with the adhesive is well fabricated. The optimum OPE based adhesive possesses a peel strength of 1.21 N/mm, Dk of 2.67 and Df of 0.0132 at 10 GHz. Meanwhile, the optimum GPH based adhesive possesses a peel strength of 1.31 N/mm, Dk of 2.83 and Df of 0.0153 at 10 GHz.
    In the second part of the thesis, we synthesize poly(2-allyl-6-methylphenol-co-2,6-dimethyl-phenol) (Allyl-PPE) through oxidative coupling polymerization. Next, we modify parts of the allyl groups with polar groups to improve the adhesion. A flexible adhesive laminate is also successfully prepared based on Allyl-PPE (and its derivatives) composites. The optimum Allyl-PPE based adhesive possesses a peel strength of 1.11 N/mm, Dk of 2.21 and Df of 0.0101 at 10 GHz.
    In the third part of the thesis, we introduce commercial 1,2-bis(vinylphenyl) ethane (BVPE) into the formulation of Allyl-PPE adhesives to improve electrical properties. In the basis of Allyl-PPE / BVPE blend, a flexible adhesive laminate is successfully prepared. The optimum Allyl-PPE / BVPE based adhesive possesses a peel strength of 1.33 N/mm, Dk of 2.44 and Df of 0.0108 at 10 GHz.
    The above results suggest that the structural modification and optimized formation could develop the adhesives with low Dk and Df for high frequency PCB application.

参考文献 ( 33 ) 〈TOP〉

[3] M. T. Bohr, Solid State Technol. 1996, 39, 105.
连结：
[7] C. K. Cheng, J. Lillis, S. Lin, N. Chang, “Interconnect Analysis and Synthesis”, Wiley, 1999.
连结：
[8] Z. Ahmad, “Dielectric Material” 2012, 3.
连结：
[10] J. Nunoshige, “Development of Copper Clad Laminate with Low Dielectric Loss Materials for High Frequency Devices” Hitachi Ltd., 2009.
连结：
[12] N. H. Hendricks, Solid State Technol. 1995, 38, 117.
连结：

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DOI可强化引用精确性、增强学术圈连结，并给予使用者跨平台的良好使用经验，目前在全世界已有超过五千万个对象申请DOI。如想对DOI的使用与概念有进一步了解，请参考（）。