三維異質整合技術應用於超高解析度腦神經訊號擷取感測器

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三维异质整合技术应用於超高解析度脑神经讯号撷取感测器

Ultra-High-Resolution Neural Sensing Biosensor Development with 3D Heterogeneous Integration

胡毓宸 , 博士　　导师：陈冠能　　

英文

三维积体电路；矽中介层；异质整合； 3DIC ； Silicon interposer ； Heterogeneous integration

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摘要 │ 参考文献 (48) │ 国际计量

摘要〈TOP〉

本博士论文旨在研究三维积体电路技术(3D IC)应用於超高解析度脑神经讯号撷取感测器并进行异质整合封装制程之探讨，随着封装能力的不同以及动物实验回馈给工程端的生医感测器结构优化，本研究提出三种不同结构之超高解析度脑神经讯号撷取感测器，分别为3D-系统级封装(System-in-Packaging, SiP)型生医感测器、2.5D-矽中介层(Si-interposer)型生医感测器以及2.5D-可挠式(PI Flexible-interposer)型生医感测器。此三种生医感测器不论从异质整合封装的角度或是脑神经讯号传输的角度，新颖以及跨领域的设计架构使得此超高解析度脑神经讯号撷取感测器具有突破性的重大创新。
近年来，脑神经科学不断地被各国所重视。其中，如何有效地撷取脑神经讯号更是所有研发之中最关键的一步，因此，各类型的脑神经讯号撷取感测器推陈出新，期望能制作出全面性的功能。而一个优异的生医感测器必须具备低讯号损失、低杂讯以及超高解析度、超高通道的特性；此外，为了达到特定需求，如实验目标需自由移动，生医感测器之轻薄短小也有其必要性，因此，本研究利用矽半导体标准制程可达到极细线宽的能力来满足其超高解析度之需求；同时采用三维积体电路技术来进行高度异质整合，将整体封装体积降至最小；同时，由於绕线距离大幅降低，杂讯以及讯号损失皆可有效下降。此类型生医感测器结构分为三大部分：矽穿孔(Through silicon via, TSV)内埋式电极探针、中介层以及生医晶片。本论文依照功能取向之不同发展三种不同封装之生医感测器，但主体架构仍以上述三大结构为主。
第一类型之3D-系统级封装生医感测器：
此类型生医感测器为二电路晶片面对面(face-to-face)接合，并使用打线接合(wire bonding)方式将讯号连接至矽中介层，再利用矽中介层之重新分布绕线(redistribution layer, RDL)以及矽穿孔连接至中介层下方之矽穿孔内埋式电极探针以完成此生医感测器。系统级封装拥有较低成本以及开发时间短的优势，因此率先采用於脑神经讯号撷取感测器。在此一研发阶段，本研究同时开发晶片级(chip level)异质整合平台用以克服晶圆级三维积体电路制程过於昂贵的问题。
第二类型2.5D-矽中介层型生医感测器：
此类型生医感测器采用矽中介层为关键技术，将生医晶片整合於其之上，由於采用覆晶接合(flip-chip bonding)技术，封装体积可较第一类型更加微缩，矽中介层下方之矽穿孔内埋式电极探针至生医晶片的连线距离更加缩短，可降低杂讯与讯号损失。此外，开发生物相容性之金矽穿孔以便於更安全的生物量测环境。
第三类型2.5D-可挠式型生医感测器：
此类型生医感测器将矽中介层换为可挠式中介层。因应生物量测之需求，需要更轻以及可挠式之生医感测器，因此将中介层材料由矽换为Polyimide以得到更佳之量测环境。同时也开发新型矽-Polyimide异质接合方式，发展金属薄膜接合垫(thin-film metal pad)以取代传统异方性导电胶(anisotropic conductive film, ACF)及非导电胶(non-conductive paste, NCP) 。
以上三种不同封装之脑神经讯号撷取感测器皆经由电性量测，包含Kelvin 结构、Daisy chain结构、Comb 结构来确保异质整合连线的完整性；机械强度测试，包含剪切测试来验证结构之强度；可靠度验证，包含高温循环、湿度测试以及直流电流循环测试来检验结构的稳定性。相关的材料分析以及制程开发也在本论文中详述。整体而言，本研究将三维积体电路技术引入至生医感测器开发，以达到高解析度及高通道数的要求，此新颖结构为世界首创，希冀为我国跨入此尖端领域打下基石。

并列摘要〈TOP〉

In this thesis, 3D IC technology is adopted to the neural sensing microstructure. Three different biosensors are proposed and demonstrated with different packaging approaches and animal experiment applications. 3D-SiP neural sensing biosensor, 2.5D-silicon interposer neural sensing biosensor, and 2.5D-flxeible interposer neural sensing biosensor are investigated in this thesis. With the highly integrated neural sensing microstructure, the three novel biosensors are expected to contribute to the biomedical field through identifying and solving unknown biological mysteries.
In recent years, neuroscience has been a research area that is valued by many countries. One of the key technologies of that area that is widely interested in is the approach on an effective way of extracting neural signals. Therefore, many neural sensing microstructures have been proposed with the aim of fabricating a well-functional biosensor.  A powerful functional neural sensing microstructure is critical in order to detect neural signals with low noise and high spatial resolution. Besides, the miniaturized packaging is also necessary since the mouse experimented on moves around freely during the experiment. In this research, the ultra-high-resolution demand is satisfied with the silicon semiconductor standard process, and the miniaturized packaging is achieved with the 3D heterogeneous integration technology. These biosensors can be divided into three main parts: (1) TSV-embedded electrode probe, (2) interposer, (3) neural sensing circuits. In accordance to the difference of functional aspects, three different packaging biosensors are fabricated in this thesis.
TypeⅠ: 3D-SiP neural sensing biosensor
Two circuit chips are bonded face-to-face while wire bonding is used to connect the bottom chip to an interposer. The TSV-embedded electrode probe transmits neural signals through TSV and RDL on the interposer to the connected wires. With the advantages of low cost and short development time, SIP is the first packaging approach to be implemented in the neural sensing microstructure. In this development phase, chip-level heterogeneous integration platform is also developed to overcome the over-expensive issue in 3D wafer-level packaging.
TypeⅡ: 2.5D-silicon interposer neural sensing biosensor
Silicon interposer is the key component of this type. Interposer carries multiple neural sensing circuit chips and does the routing paths between the front side chips and backside TSV-embedded electrode probe with TSV and RDL. As compared to type Ⅰ, flip-chip approach is adopted in this type to further miniaturized the packaging size. In this development phase, biocompatible Au-TSV is developed as the measuring tool that is safer for the living organisms.
Type Ⅲ: 2.5D-flxeible interposer neural sensing biosensor
In order to fulfill the demand of animal experiment, silicon interposer is replaced with polyimide for better flexibility and lighter. In addition, a novel silicon-polyimide bonding approach is developed for better electrical property than traditional anisotropic conductive film or non-conductive paste bonding approaches.
All the biosensors are tested with electrical examinations, including Kelvin structure, Daisy chain, and Comb structure. Mechanical strength test is adopted to ensure the robustness of the structure. Reliability tests are evaluated including thermal cycling test (TCT), un-bias highly accelerated stress test (un-bias HAST) and multiple current stressing test. Material analysis and process developments are detailed depict in this thesis. Overall, 3D IC technology is introduced into biosensor development in this research for ultra-high-resolution. The novel heterogeneous integration structure is a breakthrough in both the medical field and electronic field, and will contribute to multiple disciplines in the future.

参考文献 ( 48 ) 〈TOP〉

[1] B. Tan, "Deep micro hole drilling in a silicon substrate using multi-bursts of nanosecond UV laser pulses," Journal of Micromechanics and Microengineering, vol. 16, p. 109, 2006.
连结：
[2] K. Takahashi and M. Sekiguchi, "Through Silicon Via and 3-D Wafer/Chip Stacking Technology," in 2006 Symposium on VLSI Circuits, 2006. Digest of Technical Papers., 2006, pp. 89-92.
连结：
[3] S. K. Lynch, C. Liu, N. Y. Morgan, X. Xiao, A. A. Gomella, D. Mazilu, et al., "Fabrication of 200 nm period centimeter area hard x-ray absorption gratings by multilayer deposition," Journal of Micromechanics and Microengineering, vol. 22, p. 105007, 2012.
连结：
[4] C. Chienliu, W. Yeong-Feng, K. Yoshiaki, S. Ji-Jheng, K. Yusuke, L. Chih-Kung, et al., "Etching submicrometer trenches by using the Bosch process and its application to the fabrication of antireflection structures," Journal of Micromechanics and Microengineering, vol. 15, p. 580, 2005.
连结：
[5] G. Craciun, M. A. Blauw, E. v. d. Drift, P. M. Sarro, and P. J. French, "Temperature influence on etching deep holes with SF 6 /O 2 cryogenic plasma," Journal of Micromechanics and Microengineering, vol. 12, p. 390, 2002.
连结：

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使用DOI作为永久连结

引用含有DOI的文献

DOI可强化引用精确性、增强学术圈连结，并给予使用者跨平台的良好使用经验，目前在全世界已有超过五千万个对象申请DOI。 如想对DOI的使用与概念有进一步了解，请参考 （ ） 。

DOI可强化引用精确性、增强学术圈连结，并给予使用者跨平台的良好使用经验，目前在全世界已有超过五千万个对象申请DOI。如想对DOI的使用与概念有进一步了解，请参考（）。